1. 2. 3. material content data sheet sales product name tle4274gs v25 issued 28. august 2013 ma# MA000741326 package pg-sot223-4-21 weight* 112.04 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.163 1.04 1.04 10376 10376 leadframe inorganic material silicon 7440-21-3 0.010 0.01 90 non noble metal titanium 7440-32-6 0.051 0.05 453 non noble metal chromium 7440-47-3 0.152 0.14 1358 non noble metal copper 7440-50-8 50.489 45.06 45.26 450637 452538 wire noble metal gold 7440-57-5 0.117 0.10 0.10 1048 1048 encapsulation organic material carbon black 1333-86-4 0.461 0.41 4118 plastics brominated resin - 0.577 0.51 5148 inorganic material antimonytrioxide 1309-64-4 1.154 1.03 10296 plastics epoxy resin - 10.497 9.37 93692 inorganic material silicondioxide 60676-86-0 44.988 40.15 51.47 401539 514793 leadfinish non noble metal tin 7440-31-5 1.464 1.31 1.31 13067 13067 plating noble metal silver 7440-22-4 0.513 0.46 0.46 4579 4579 glue plastics epoxy resin - 0.071 0.06 630 noble metal silver 7440-22-4 0.333 0.30 0.36 2969 3599 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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